Tips and Tricks for Successfully Cleaning Circuit Assemblies
Tech-Tuesday 2019 Webinars continue with "Tips and Tricks for Successfully Cleaning Circuit Assemblies".
In the last half of the 20th century, cleaning of circuit assemblies was a standard assembly practice. The abolishment of popular CFC-based cleaning solvents ushered the introduction of "no-clean" assembly processes. For much of the electronic assembly industry, cleaning became nonexistent.
Due to assembly and component miniaturization and the explosion of both IOT and automotive electronics, which places many circuit assemblies into harsh environments, the practice of removing harmful ionic contamination from circuit assemblies has once again become a mainstream practice. Today, the majority of electronic assemblies are cleaned. And, for many assemblers, cleaning is a new process.
This webinar will present modern best-practice cleaning techniques including:
- An historical look back at cleaning
- The reason for cleaning
- Reasons for cleaning no-clean flux residues
- Conventional cleaning technologies
- Estimating throughput capabilities on batch and inline cleaning systems
- Do's and don'ts of cleaning circuit assemblies
- How to choose a cleaning chemical (if needed)
- How to determine the assemblies are clean during the cleaning process
- How to determine the assemblies are clean after the cleaning process
- New IPC Cleanliness assessment standards
- Environmental mitigation techniques
- Calculating the per-assembly cost of cleaning
- Keeping your cleaning machine in top-working order
Who should attend?
This webinar is designed for assemblers who are cleaning assemblies and those who are considering a cleaning process.
Improving Reliability of Circuit Assemblies in Harsh Environments
With the rapid expansion of IOT, many circuit assemblies are now functioning in unfamiliar environments, many of these environments are harsh. Additionally, many new electronic applications control critical systems such as automotive electronics. This webinar focuses on the influence contamination plays on reliability of circuit assemblies, particularly when operated in harsh environments.
Several contamination-related failure mechanisms will be presented including electro-chemical migration (dendritic growth, parasitic leakage) and conductive anodic filament (CAF). Methods to determine how clean is clean enough will be discussed.
Lessons Learned from a Contract Manufacturer and Their Customer Who Sued Them
Originally presented at Surface Mount Technology International in 2017 to a standing-room only audience, Aqueous Technologies is proud to announce the return of SMT WARS.
What happens when an electronic contract manufacturer follows their customer’s instructions to the detriment of the product? Product failures, blame, drama, and a really big lawsuit.
Mike Konrad will present this webinar and will review the trials and tribulations of a contract manufacturer and their customer. Assembly residue-related failures (ECM) contributed to product failures, product recalls, and, ultimately, a multi-million-dollar lawsuit.
Misguided “best practice” techniques only made matters worse. This paper will discuss what factors contributed to the “perfect storm” of product failures. Factors that go as far back to original product designs, printed circuit board fabrication, storage and handling, assembly, testing, and coating. While mistakes were made all along the way, product failures could have been avoided with a few simple process changes, adding mere pennies to the cost of each assembly while saving hundreds of thousands of dollars in litigation.