Improving Reliability of Circuit Assemblies in Harsh Environments
A Webinar


With the rapid expansion of IOT, many circuit assemblies are now functioning in unfamiliar environments, many of these environments are harsh. Additionally, many new electronic applications control critical systems such as automotive electronics. This webinar focuses on the influence contamination plays on reliability of circuit assemblies, particularly when operated in harsh environments. 

Several contamination-related failure mechanisms will be presented including electro-chemical migration (dendritic growth, parasitic leakage) and conductive anodic filament (CAF). Methods to determine how clean is clean enough will be discussed.

Previous Webinars

Lessons Learned from a Contract Manufacturer and Their Customer Who Sued Them

Originally presented at Surface Mount Technology International in 2017 to a standing-room only audience, Aqueous Technologies is proud to announce the return of SMT WARS. 

What happens when an electronic contract manufacturer follows their customer’s instructions to the detriment of the product? Product failures, blame, drama, and a really big lawsuit.  

Mike Konrad will present this webinar and will review the trials and tribulations of a contract manufacturer and their customer. Assembly residue-related failures (ECM) contributed to product failures, product recalls, and, ultimately, a multi-million-dollar lawsuit. 

Misguided “best practice” techniques only made matters worse. This paper will discuss what factors contributed to the “perfect storm” of product failures. Factors that go as far back to original product designs, printed circuit board fabrication, storage and handling, assembly, testing, and coating. While mistakes were made all along the way, product failures could have been avoided with a few simple process changes, adding mere pennies to the cost of each assembly while saving hundreds of thousands of dollars in litigation. 

Tips and Tricks for Successfully Cleaning of Circuit Assemblies provides in-depth best-practice advise for successful removal of flux and other assembly related residues. Covered topics include: 

An historical look back at cleaning

The reasons for cleaning

Reasons for cleaning no-clean flux residues

Conventional cleaning technologies

Estimating throughput capabilities on batch and inline cleaning systems

Do's and don'ts of cleaning circuit assemblies

How to choose a cleaning chemical (if needed)

How to determine the assemblies are clean during the cleaning process

How to determine the assemblies are clean after the cleaning process

Environmental mitigation techniques

Calculating the per-assembly cost of cleaning

Keeping your cleaning machine in top-working order

Cleanliness Quantification Techniques
- How Clean is Clean Enough?

There is a direct relationship between cleanliness and reliability. Most contamination related product failures could have been predicted by cleanliness testing and thereby avoided. With industry standards changing, various cleanliness testing methods are being considered.   

This webinar will present information on several post-reflow circuit assembly cleanliness quantification methods including:

  - Bulk Extraction ROSE Testing
  - Localized Extraction ROSE Testing
 - Ion Chromatography
  - Surface Insulation Resistance (SIR)
  - Presence of Flux (Chemical Reaction) Testing
  - Visual Testing
  - Other Cleanliness Testing Methods