Experts in solder paste printing, thermal profiling, cleaning (equipment and chemicals), and cleanliness/reliability assessment will all get together to present "The SMT Process: PCB Build to Reliability Assessment Workshop".
Both presentations and a hands-on laboratory session combine to provide a complete educational and practical experience.
This workshop is free and seating is limited. Register now to guarantee admission.
ITW/EAE - Optimizing Printing for Small Apertures through Design, Machine, and Process Parameters to Eliminate Printing Defects
ITW/EAE - Thermal Profiling and Post Reflow Processing Issues
ZESTRON Americas - Improvements in Yield and Reliability for SMT Processes via Cleaning
Aqueous Technologies - Collateral Cleaning: The Unintended Consequences of Cleaning Electronic Assemblies
ITW/EAE - Reinventing the Wheel: Importance of Spray Technologies and Nozzle Configuration in the Cleaning Process
Foresite - Electronic Assembly: Where do the Contaminants Come From?
Plus Lab Demonstrations:
An interactive hands-on training session in a small group setting with the following equipment:
Omnimax 10 Zone Reflow
Surface cleanliness assessments and bath monitoring techniques