Live Event!

Experts in solder paste printing, thermal profiling, cleaning (equipment and chemicals), and cleanliness/reliability assessment will all get together to present "The SMT Process: PCB Build to Reliability Assessment Workshop". 

Both presentations and a hands-on laboratory session combine to provide a complete educational and practical experience.

This workshop is free and seating is limited. Register now to guarantee admission.


Click here for full abstracts

ITW/EAE - Optimizing Printing for Small Apertures through Design, Machine, and Process Parameters to Eliminate Printing Defects

ITW/EAE - Thermal Profiling and Post Reflow Processing Issues

ZESTRON Americas - Improvements in Yield and Reliability for SMT Processes via Cleaning

Aqueous Technologies - Collateral Cleaning: The Unintended Consequences of Cleaning Electronic Assemblies

ITW/EAE - Reinventing the Wheel: Importance of Spray Technologies and Nozzle Configuration in the Cleaning Process

Foresite - Electronic Assembly: Where do the Contaminants Come From?

Plus Lab Demonstrations:
An interactive hands-on training session in a small group setting with the following equipment:

  • Omnimax 10 Zone Reflow

  • Aquastorm 200

  • StencilWasher

  • Trident

  • C3

  • Surface cleanliness assessments and bath monitoring techniques