IPC HIGH RELIABILITY FORUM & MICROVIA SUMMIT
May 14-16, 2019
The IPC High Reliability Forum and Microvia Summit will focus on Class 3 electronics used for mil-aero, automotive, or long-life applications. The event offers a well-rounded selection of the most current topics related to reliability and how to make the best materials, process, and testing choices to achieve exceptional performance goals.
The IPC High Reliability Forum and Microvia Summit provides an opportunity to interface with subject matter experts (SMEs) and the panel discussions allow for interaction between the audience and SMEs, facilitating true problem solving and cooperation to share best practices across different applications.
Presentation sessions include:
PCB design and laminate reliability
Surface cleanliness testing and reliability
Microvia considerations and standards development updates
Panel discussions will address:
Board and surface reliability challenges
Microvia reliability testing