Tech-Tuesday: Tips & Tricks for Successful Cleaning of Circuit Assemblies - A Webinar

Tech-Tuesday 2017 Webinars continue with "Tips and Tricks for Successful Cleaning of Circuit Assemblies".

In the last half of the 20th century, cleaning of circuit assemblies was a standard assembly practice. The abolishment of popular CFC-based cleaning solvents ushered the introduction of "no-clean" assembly processes. For much of the electronic assembly industry, cleaning was nonexistent.  Over the past several years, cleaning has regained popularity. Today, the majority of electronic assemblies are cleaned. For many assemblers, cleaning is a new process.

This webinar will present modern best-practice cleaning techniques including:

  • Tips for maximizing cleaning results
  • Do's and don'ts of cleaning circuit assemblies
  • How to choose a cleaning chemical (if needed)
  • Preventing (or mitigating) foam during cleaning
  • Estimating throughput capabilities on batch and inline cleaning systems
  • How to determine the assemblies are clean during the cleaning process
  • How to determine the assemblies are clean after the cleaning process
  • Environmental mitigation techniques
  • Calculating the per-assembly cost of cleaning
  • Keeping your cleaning machine in top-working order
  • And other valuable tips and tricks

Who should attend? 
This webinar is designed for assemblers who are cleaning assemblies and those who are considering a cleaning process. 

This webinar is free of charge

The SMT Process: PCB Build to Reliability Assessment Workshop (Live Event)

Live Event!

Experts in solder paste printing, thermal profiling, cleaning (equipment and chemicals), and cleanliness/reliability assessment will all get together to present "The SMT Process: PCB Build to Reliability Assessment Workshop". 

Both presentations and a hands-on laboratory session combine to provide a complete educational and practical experience.

This workshop is free and seating is limited. Register now to guarantee admission.


Click here for full abstracts

ITW/EAE - Optimizing Printing for Small Apertures through Design, Machine, and Process Parameters to Eliminate Printing Defects

ITW/EAE - Thermal Profiling and Post Reflow Processing Issues

ZESTRON Americas - Improvements in Yield and Reliability for SMT Processes via Cleaning

Aqueous Technologies - Collateral Cleaning: The Unintended Consequences of Cleaning Electronic Assemblies

ITW/EAE - Reinventing the Wheel: Importance of Spray Technologies and Nozzle Configuration in the Cleaning Process

Foresite - Electronic Assembly: Where do the Contaminants Come From?

Plus Lab Demonstrations:
An interactive hands-on training session in a small group setting with the following equipment:

  • Omnimax 10 Zone Reflow

  • Aquastorm 200

  • StencilWasher

  • Trident

  • C3

  • Surface cleanliness assessments and bath monitoring techniques