Contamination Associated Failure Mechanisms & How to Avoid Them

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2018 Tech Tuesday Webinar Series Continues With:

Contamination Associated Failure Mechanisms and How to Avoid Them

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Tech-Tuesday 2018 Webinars continue with "Contamination Associated Failure Mechanisms and How to Avoid Them".

This webinar provides valuable information about contamination related failure mechanisms including Electro-Chemical Migration (ECM) and its various manifestations (dendritic growth, parasitic leakage, and CAF), coating adhesion failures, and offensive residues. 

This presentation will also discuss the reasons some assemblies suffer contamination-related failures while other assemblies with identical levels of contamination remain reliable. 

This one hour technical webinar will be presented live by Mike Konrad, an SMTA "Distinguished Speaker" and is offered free of charge.

Electronics in Harsh Environments Conference

Electronics in Harsh Environments Conference 24-26 April 2018 Crowne Plaza Amsterdam - Schiphol Planeetbaan 2, Hoofddorp, 2132 HZ, Netherlands - View Map

Electronics in Harsh Environments Conference

24-26 April 2018

Crowne Plaza Amsterdam - Schiphol

Planeetbaan 2, Hoofddorp, 2132 HZ, Netherlands - View Map

Building on the successful Contamination, Cleaning and Coating Conference in 2017, SMTA Europe will host the Electronics in Harsh Environments Conference on 24-26 April 2018 in Amsterdam, Netherlands. The conference will focus on building reliable electronics used in power electronics and harsh environments. 

Thermal, power and signal integrity requirements can present challenges when on devices that operate within harsh environments. Component integration, paired with a growing complexity of the package architectures, larger form factors and higher interconnection densities increase the risk of in-field failures. Over powering or over heating of a device can have serious consequences including internal package failure, down-stream device errors and second level interconnect solder joint failures. Soldering residues are more problematic, and if not understood, can result in both intermittent and complete device failure. 

This conference tackles the challenges and best practices for building reliable electronic devices that will perform to design standards when used in harsh environments. Specific topics include building reliable high density assemblies, power electronics, electric hybrids, product assembly challenges, cleaning, coating, process control, and monitoring and tracking production hardware. Challenging areas such as high temperature soldering, solder material advances, and new standards will be presented.