Now Available On-Demand

Cleaning for Reliability
An On-Demand Webinar

The latest webinar in our Tech-Tuesday Webinar Series covers cleaning and cleanliness testing best-practices including:

  • Contamination failure mechanisms

  • Cleaning challenges and strategies to overcome them

  • Environmental best practices (how to solve one problem and not create another)

  • Choosing an appropriate cleaning method (a review of various cleaning methods)

  • How clean is clean enough?

  • The cost of cleaning

  • Choosing an appropriate cleaning chemical (if needed)

  • Cleaning "no-clean" flux

  • Questions and answers

This webinar is free of charge and will last one hour and fifteen minutes.

Register and watch anytime:


ECM and IOT. How to Predict, Quantify, and
Mitigate ECM Failure Potential
An On-Demand Webinar

Electro-chemical migration (ECM) has become an issue for many assemblers. This webinar will address the current factors influencing ECM-related failure mechanisms and how it affects reliability. Factors that assist in the prediction of ECM will be presented as well as methods to quantify and prevent ECM and other contamination-related failures.

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Understanding the New IPC J-STD 001- G Amendment 1 Cleanliness Testing Standard
An On-Demand Webinar

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The widely anticipated revised cleanliness testing standard is now active. What’s next?

This on-demand webinar will cover the requirements of the new IPC J-STD001-G Amendment 1 cleanliness testing standard. What’s new, what stays the same? This webinar will uncover the details of the new standard, especially the “Objective Evidence” requirement of the new specification.

Complete the form below to view this webinar on-demand.

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Previous Webinars

Tips and Tricks for Successfully Cleaning Circuit Assemblies

Tech-Tuesday 2019 Webinars continue with "Tips and Tricks for Successfully Cleaning Circuit Assemblies".

In the last half of the 20th century, cleaning of circuit assemblies was a standard assembly practice. The abolishment of popular CFC-based cleaning solvents ushered the introduction of "no-clean" assembly processes. For much of the electronic assembly industry, cleaning became nonexistent. 

Due to assembly and component miniaturization and the explosion of both IOT and automotive electronics, which places many circuit assemblies into harsh environments, the practice of removing harmful ionic contamination from circuit assemblies has once again become a mainstream practice. Today, the majority of electronic assemblies are cleaned. And, for many assemblers, cleaning is a new process.

This webinar will present modern best-practice cleaning techniques including:

- An historical look back at cleaning

- The reason for cleaning

- Reasons for cleaning no-clean flux residues

- Conventional cleaning technologies

- Estimating throughput capabilities on batch and inline cleaning systems

- Do's and don'ts of cleaning circuit assemblies

- How to choose a cleaning chemical (if needed)

- How to determine the assemblies are clean during the cleaning process

- How to determine the assemblies are clean after the cleaning process

- New IPC Cleanliness assessment standards

- Environmental mitigation techniques

- Calculating the per-assembly cost of cleaning

- Keeping your cleaning machine in top-working order

Who should attend?

This webinar is designed for assemblers who are cleaning assemblies and those who are considering a cleaning process.

Improving Reliability of Circuit Assemblies in Harsh Environments
A Webinar

Description

With the rapid expansion of IOT, many circuit assemblies are now functioning in unfamiliar environments, many of these environments are harsh. Additionally, many new electronic applications control critical systems such as automotive electronics. This webinar focuses on the influence contamination plays on reliability of circuit assemblies, particularly when operated in harsh environments. 

Several contamination-related failure mechanisms will be presented including electro-chemical migration (dendritic growth, parasitic leakage) and conductive anodic filament (CAF). Methods to determine how clean is clean enough will be discussed.


Listen to the Reliability Matters Podcast. Available on iTunes, Spotify, iHeart Radio, and -HERE-


SMT-WARS
Lessons Learned from a Contract Manufacturer and Their Customer Who Sued Them

Originally presented at Surface Mount Technology International in 2017 to a standing-room only audience, Aqueous Technologies is proud to announce the return of SMT WARS. 

What happens when an electronic contract manufacturer follows their customer’s instructions to the detriment of the product? Product failures, blame, drama, and a really big lawsuit.  

Mike Konrad will present this webinar and will review the trials and tribulations of a contract manufacturer and their customer. Assembly residue-related failures (ECM) contributed to product failures, product recalls, and, ultimately, a multi-million-dollar lawsuit. 

Misguided “best practice” techniques only made matters worse. This paper will discuss what factors contributed to the “perfect storm” of product failures. Factors that go as far back to original product designs, printed circuit board fabrication, storage and handling, assembly, testing, and coating. While mistakes were made all along the way, product failures could have been avoided with a few simple process changes, adding mere pennies to the cost of each assembly while saving hundreds of thousands of dollars in litigation. 


Tips and Tricks for Successfully Cleaning of Circuit Assemblies provides in-depth best-practice advise for successful removal of flux and other assembly related residues. Covered topics include: 

An historical look back at cleaning

The reasons for cleaning

Reasons for cleaning no-clean flux residues

Conventional cleaning technologies

Estimating throughput capabilities on batch and inline cleaning systems

Do's and don'ts of cleaning circuit assemblies

How to choose a cleaning chemical (if needed)

How to determine the assemblies are clean during the cleaning process

How to determine the assemblies are clean after the cleaning process

Environmental mitigation techniques

Calculating the per-assembly cost of cleaning

Keeping your cleaning machine in top-working order

Cleanliness Quantification Techniques
- How Clean is Clean Enough?

There is a direct relationship between cleanliness and reliability. Most contamination related product failures could have been predicted by cleanliness testing and thereby avoided. With industry standards changing, various cleanliness testing methods are being considered.   

This webinar will present information on several post-reflow circuit assembly cleanliness quantification methods including:

  - Bulk Extraction ROSE Testing
  - Localized Extraction ROSE Testing
 - Ion Chromatography
  - Surface Insulation Resistance (SIR)
  - Presence of Flux (Chemical Reaction) Testing
  - Visual Testing
  - Other Cleanliness Testing Methods